Company: Aptek Laboratories Inc
City: Valencia
Country: USA
url: http://www.apteklabs.com
Established in 1986, Aptek Laboratories provides custom formulated adhesives, coatings, encapsulants, and specialty fabricated films/substrates to highly sophisticated end users such as Boeing Satellite Systems, Raytheon Company, Northrop Grumman/Litton, Lockheed Martin, Delco, TRW and many others. To support the requirements and technical demands of these customers, Aptek devotes a major portion of its resources for research and development, technical service, quality assurance and state-of-the-art production equipment. Although Aptek has targeted high-tech applications as a major market thrust, this same philosophy and expertise is applied to the high-end commercial markets as well.
Customer demand for faster curing products led to the development of advanced snap-cure technology as well as state-of-the-art UV-cured systems. These production-friendly products exceeded both the handling and physical property requirements of the end users. UVIKOTE(tm) 7503LM-PMF (pre-mixed frozen), a UV-cured PCB coating system, not only cures in seconds and is qualified to MIL-I-46058-C, but also meets the NASA outgassing requirements per ASTM-E-595. UVIKOTE 7503LM-PMF is comparable in performance to APTEK(r) 2503-A/B, a superior conventionally cured polyurethane MIL-Spec conformal coating which is the material of choice for many military and space programs. Snap-cure low modulus adhesives are best represented by DIS-A-PASTE(r) 2310-PMF (electrically insulative) and DIS-A-PASTE 2313-PMF (electrically conductive). The extraordinary escalation of surface mount technology, with ever-increasing power demands in smaller packages, has made thermal and stress management a "hot" topic. Aptek accepted the challenge and developed a full line of thermally conductive, low modulus films and adhesives designated as DAT-A-THERM(tm) and DIS-A-PASTE. The DAT-A-THERM C- staged film or pad is utilized as a spacer between an SMT device and the circuit board substrate and, when bonded with a DIS-A-PASTE adhesive, the combination provides superior adhesion and thermal dissipation to difficult-to-bond surfaces such as gold and ceramics without the use of a primer.
